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 Post subject: Taiwan memory module makers claiming tight NAND flash backen
PostPosted: Sat Nov 12, 2005 2:07 am 

Joined: Tue Jun 14, 2005 6:12 pm
Posts: 82
Taiwan memory module makers claim they are suffering from a NAND flash related packaging bottleneck amid tight backend capacity, and the situation is unlikely to ease within the next three to six months.

In general, NAND flash is packed using chip on board (COB) packaging, which is under the laminate MMC packaging (see picture below). Under this type of package, each die is directly mounted and connected onto the circuit board, with the shorter interconnection paths enhancing the interconnection, as well as the overall performance.

The memory module makers indicated that there are only a few COB package suppliers in Taiwan, including Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries Ltd (SPIL), Powertech Technology Inc. (PTI) and Orient Semiconductor Electronics (OSE). However, the COB related capacity from these players has already been reserved by larger international vendors.

COB capacity at SPIL and PTI is respectively occupied by SanDisk and Toshiba, while ASE and OSE also have no available COB capacity, the sources noted. Some memory module makers even have to wait one quarter to receive their products.

Despite demand for COB packaging remaining substantial, packaging houses are still reluctant to expand their related capacity amid margin concerns, a Commercial Times report quoted sources at packaging houses as saying. In the highly volatile memory card market, device makers cannot be counted on to place stable orders and they have limited room to accept price rises, so packaging houses are unwilling to budget for expansion.


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 Post subject: Re: Taiwan memory module makers claiming tight NAND flash backen
PostPosted: Fri Oct 19, 2018 8:44 pm 

Joined: Wed Nov 22, 2017 6:55 pm
Posts: 88
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