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 Post subject: ChipMOS, Spansion Ink Agreement Before IPO
PostPosted: Tue Dec 13, 2005 6:18 pm 

Joined: Mon Jul 11, 2005 10:23 pm
Posts: 360
Taiwan’s ChipMOS Technologies has entered into an assembly and testing agreement with Spansion LLC, the flash memory venture of Advanced Micro Devices and Fujitsu.

In typical ChipMOS fashion, the company gave little detail on the partnership, only saying that under the agreement ChipMOS Taiwan will become an outsource provider of assembly and testing services for Spansion.
We continue to expand our customer base and engagements with existing customers because of our investments in advanced technology, our geographic location and our commitment to serving our customers,” said S.J. Cheng, chairman and CEO of ChipMOS, in a statement today. “We look forward to strengthening our partnership with Spansion.”

The news comes as Spansion is expected to price its initial public offering this week. The company in Securities Exchange Commission filings last week said it plans to raise about $622 million by selling more than 39 million shares of common stock, priced between $16 and $18. If sold, the flash company will record one of the largest IPOs for the year.
http://www.reed-electronics.com/electronicnews/article/CA6290560.html


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 Post subject: Re: ChipMOS, Spansion Ink Agreement Before IPO
PostPosted: Thu Oct 24, 2019 2:13 pm 

Joined: Thu Dec 21, 2017 5:46 pm
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