DRAMeXchange - Price, Transactions, and research inside DRAM/Flash industry

It is currently Fri Nov 15, 2019 2:33 am

All times are UTC + 8 hours





Post new topic Reply to topic  [ 2 posts ] 
Author Message
 Post subject: Infineon: No operation reshuffle for memory unit spin-off
PostPosted: Tue Dec 13, 2005 6:12 pm 

Joined: Mon Jul 11, 2005 10:23 pm
Posts: 360
Although Infineon Technologies is still considering whether to go ahead with an initial public offering (IPO) for its memory division, Loh Kin Wah, who is expected to head the spin-off, reaffirmed that the focus of the new company would remain unchanged, although it would diversify its product portfolio.

Under the new business realignment announced in November, Infineon plans to establish two independent business units, one for logic ICs and one for memory, with the memory business unit being spun off as an independent unit by July 1, 2006.

During a recent visit to Taiwan, Loh stated that Infineon is confident the new company will maintain its competitive standing in the DRAM market, based on the strength of its products, which are manufactured using trench technology. Loh indicated that Infineon currently has a 15% share of the trench-made DRAM market. In addition, that percentage does not include the 7% share that Infineon’s joint-venture, Inotera Memories, has of the market.

Infineon has already entered volume production on 90nm process node, and has started pilot runs on 70nm production, Loh indicated. The company is also currently developing 60nm production.

However, Loh reiterated that the new company will not solely focus on PC-use memory. The new company will broaden its product portfolio to gradually increase its sales volume of higher margin products, such as memory applications for servers, graphics, consumer electronics and communications.

Loh stated the new company will have a 12-inch fab in Germany, as well as production facilities in the US, where capacity at its Virginia-based plant is expected to hit 20,000 wafers in March 2006. The plant has a maximum planned capacity of 60,000 wafers.

Infineon currently only outsources 15% of its memory production to its allied partners, including Winbond Electronics and Semiconductor Manufacturing International Corporation (SMIC), and this proportion should not change, Loh said.

Despite some analysts having a conservative outlook for 2006, Loh stated that the DRAM industry should not suffer from oversupply next year, as makers continue to diversify their products. In addition, an expected price drop of 40% for DRAM next year is normal for the industry.

Loh predicted that the NAND flash would be the memory segment that saw increased pricing pressure next year, as industry players continue to accelerate their process advancement. Price drops in the NAND flash segment will outpace price drops in the DRAM segment, Loh predicted.

In related news, Infineon today announced that its 512Mbit GDDR3 (Graphic Double-Data-Rate 3) graphics DRAM were selected by ATI Technologies for use with its Mobility Radeon X1600 graphics processor targeting notebook PCs.


Top
 Profile  
 
 Post subject: Re: Infineon: No operation reshuffle for memory unit spin-off
PostPosted: Thu Oct 24, 2019 2:14 pm 

Joined: Thu Dec 21, 2017 5:46 pm
Posts: 128
Image SourceImage SourceImage SourceImage SourceImage SourceImage SourceImage SourceImage SourceImage Source


Top
 Profile  
 
Display posts from previous:  Sort by  
Post new topic Reply to topic  [ 2 posts ] 

All times are UTC + 8 hours



Who is online

Users browsing this forum: google [bot] and 182 guests


You cannot post new topics in this forum
You cannot reply to topics in this forum
You cannot edit your posts in this forum
You cannot delete your posts in this forum
You cannot post attachments in this forum

Search for:
Jump to:  
© 2011 DRAMeXchange, a Business Division of TrendForce Corp. All rights reserved.