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EEMS ASIA Co. Ltd, 100% controlled by EEMS ITALIA, is the parent Company of EEMS CHINA Co. Ltd.

EEMS back-end activities, located in Asia (China), cover all manufacturing steps starting from silicon wafers of our IDM customers, throughout the component assembly and test, and from there extending into the complete subsystems testing, packing and shipping to customers' warehouse or directly dropping to their OEM destinations.
Along with Production, a variety of Technology Development and Engineering Services are available to complete the offering and provide a one-stop-shop solution to customers.

With the objective to serve the growing needs for outsourcing in the Semiconductor Industry, EEMS distinguishes for the unique blend between long dated expertise in Semiconductors/Memory and the fully integrated business model.
The memory packaging specialist
EEMS geographic deployment is able to exploit links with a powerful supply chain in Asia.
The outcome is an extraordinarily experienced team, capable to offer a wide breadth of solutions and values to selected customers willing to invest into long term strategic relationships.

Our Asia business operations is managed by a team with a significant experience that ensures world class customer service standards.
Our factories and processes are planned to integrate customer’s production requirements, thus becoming Customers Virtual Factories.
Our customers are always in control of their production status which enables them to plan faster and better.

http://www.eems.com/en.php?pid=141&page=EEMS%20Asia

EEMS China

EEMS CHINA Pte. Ltd. is the parent Company of EEMS Suzhou Co. Ltd. and EEMS Tech Co. Ltd., the two operating companies of EEMS ASIA

Since February 2007, EEMS China received the ISO 14001 Certification. Below, the Company's Green House Report, in compliance with the above mentioned certification.

Download Green House Gases Report

EEMS Suzhou and EEMS Tech are the first independent A/T Service provider in China to offer state-of-the-art 300mm assembly line packaging with a wide array of packages in single and stacked die configuration. Assembly services offered :

IC Packaging - FdBGA, FBGA, TSOP I, TSOP II, HQFP, e-LQFP, LQFP
Module Assembly - UDIMM, SODIMM


EEMS high value test assets deliver high end and competitive test solutions:

Advanced Memory Test on Advantest T5503, Verigy V93k, Unitest Uni930 and JEC TDBI systems
System applications test for memory modules and customized end applications


EEMS strong engineering team offer value added services in addition to production engineering capabilities:

IC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure AnalysisIC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure AnalysisIC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure Analysis


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PRESS ROOM
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According to me is a big occasion, in anticipation of an economic recovery.

Semiconductors and photovoltaics are 2 areas that fly with economic development.

Quoted in Italy

the climb begins !!!