DRAMeXchange - Price, Transactions, and research inside DRAM/Flash industry

today (date-03-02-2012) delhi (india)
micro sd card wholesale price Information
2GB -@ 113.50 INR (bulk packing) samsung
2GB -@ 113 INR (bulk packing) OEM like-- NW

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today (date-02-02-2012) delhi (india)
micro sd card wholesale price Information
2GB -@ 116.50 INR (bulk packing) samsung
2GB -@ 116 INR (bulk packing) OEM like-- NW

today (date-02-02-2012) delhi (india)
micro sd card wholesale price Information
2GB -@ 118 INR (bulk packing) samsung
2GB -@ 117 INR (bulk packing) OEM like-- NW

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Ten times faster? Are you excited about USB 3.0?
Surely launching Windows 8 is an inspiring news already. Moreover, USB 3.0 will truly bring our lives more convenience.

Quote "Microsoft has revealed that Windows 8 will boast “robust” support for USB 3.0 devices, though it will continue to support old USB specifications.

Microsoft’s Dennis Flanagan, the director of program management for its Devices and Networking group, explained the engineering work Microsoft is undertaking to support USB 3.0 on the company’s blog. The USB standard is more than 10 times as fast as its predecessor, USB 2.0. Its competitor, Apple, has opted for the faster Thunderbolt standard.

“The decision to invest in USB 3.0 was an easy one to make, but doing so without compromising the existing USB ecosystem was a big challenge to overcome,” Flanagan said in a blog post. “Our design had to follow the revised 3.0 specification precisely in order to enable emerging USB 3.0 hardware. There are also billions of older USB devices that Windows must remain compatible with.”

To make USB 3.0 work with the next generation of Windows, Flanagan says that Microsoft started working with hardware manufacturers early to “meticulously design a new USB software stack for the new controller while maintaining existing interfaces and behaviors, ensuring every device and driver will work.” To do this, they refined a software model checking tool called Zing to test every aspect of its software model.

Other work done to prepare for USB 3.0 included extensive hardware testing and creating a custom tool called MUTT (USB Test Tool) “to simulate a full range of device behaviors that we’d observed over the years.” Essentially, it allowed Microsoft to test 1,000 different USB devices with a single USB thumb drive."

Samsung Electronics said that it had started producing embedded multi-chip package (eMCP) memory for use in the rapidly expanding market segment for entry- to mid-level smartphones. Samsung’s new eMCP solutions utilize LPDDR2 memory made using 30nm process technology and NAND flash memory produced at 20nm-class node.

Samsung’s embedded MCP solutions are fabricated in packages that consist of a 4GB e-MMC (embedded MultiMediaCard) based on 20nm-class NAND flash memory for data storage, and a choice of 256MB, 512MBs or 768MBs of 30nm-class LPDDR2 DRAM for supporting high-performance mobile device systems. Focusing on the high-end smartphone market, Samsung’s previous eMCPs combined 1GB of 30nm-class LPDDR2 DRAM with 32GBs of eMMC memory using 20nm-class NAND flash.



“As the need is growing for more advanced software and increased data storage in smartphones and tablets, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density. Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012,” said Myungho Kim, vice president of memory marketing of device solutions at Samsung Electronics.

The 30nm-class LPDDR2 DRAM chip in the new eMCPs performs a key role in enhancing the performance of entry- to mid-level smartphones with a data transmission speed of 1066MHz, which doubles the performance of the industry’s previous mobile DRAM (MDDR).

The new eMCP memory solutions will help entry- to mid-level smartphones deliver enhanced performance and longer battery life, while providing mobile handset developers with a simpler design process.

Although business headlines still tout earnings numbers, many investors have moved past net earnings as a measure of a company's economic output. That's because earnings are very often less trustworthy than cash flow, since earnings are more open to manipulation based on dubious judgment calls.
Earnings' unreliability is one of the reasons Foolish investors often flip straight past the income statement to check the cash flow statement. In general, by taking a close look at the cash moving in and out of the business, you can better understand whether the last batch of earnings brought money into the company, or merely disguised a cash gusher with a pretty headline.
Calling all cash flows
When you are trying to buy the market's best stocks, it's worth checking up on your companies' free cash flow once a quarter or so, to see whether it bears any relationship to the net income in the headlines. That's what we do with this series. Today, we're checking in on Micron Technology (NAS: MU) , whose recent revenue and earnings are plotted below.


Over the past 12 months, Micron Technology burned $626.0 million cash while it booked a net loss of $175.0 million. That means it burned through all its revenue and more. That doesn't sound so great. FCF is less than net income. Ideally, we'd like to see the opposite.
All cash is not equal
Unfortunately, the cash flow statement isn't immune from nonsense, either. That's why it pays to take a close look at the components of cash flow from operations, to make sure that the cash flows are of high quality. What does that mean? To me, it means they need to be real and replicable in the upcoming quarters, rather than being offset by continual cash outflows that don't appear on the income statement (such as major capital expenditures).
For instance, cash flow based on cash net income and adjustments for non-cash income-statement expenses (like depreciation) is generally favorable. An increase in cash flow based on stiffing your suppliers (by increasing accounts payable for the short term) or shortchanging Uncle Sam on taxes will come back to bite investors later. The same goes for decreasing accounts receivable; this is good to see, but it's ordinary in recessionary times, and you can only increase collections so much. Finally, adding stock-based compensation expense back to cash flows is questionable when a company hands out a lot of equity to employees and uses cash in later periods to buy back those shares.
So how does the cash flow at Micron Technology look? Take a peek at the chart below, which flags questionable cash flow sources with a red bar.


When I say "questionable cash flow sources," I mean items such as changes in taxes payable, tax benefits from stock options, and asset sales, among others. That's not to say that companies booking these as sources of cash flow are weak, or are engaging in any sort of wrongdoing, or that everything that comes up questionable in my graph is automatically bad news. But whenever a company is getting more than, say, 10% of its cash from operations from these dubious sources, investors ought to make sure to refer to the filings and dig in.
With questionable cash flows amounting to only 9.9% of operating cash flow, Micron Technology's cash flows look clean. Within the questionable cash flow figure plotted in the TTM period above, stock-based compensation and related tax benefits provided the biggest boost, at 3.6% of cash flow from operations. Overall, the biggest drag on FCF came from capital expenditures.
A Foolish final thought
Most investors don't keep tabs on their companies' cash flow. I think that's a mistake. If you take the time to read past the headlines and crack a filing now and then, you're in a much better position to spot potential trouble early. Better yet, you'll improve your odds of finding the underappreciated home-run stocks that provide the market's best returns.

A Japanese trade ministry official was arrested for suspected insider trading on companies including Elpida Memory Inc. (6665), the government said.

Masaaki Kimura, 53, allegedly took advantage of his position in 2009 and traded on Elpida and NEC Electronics Corp., the Tokyo-based ministry said in a statement today. NEC Electronics merged with Renesas Technology Corp. to form Renesas Electronics Corp. in 2010.

Kimura was deputy director-general of the ministry’s commerce and information policy bureau when chipmaker Elpida received 30 billion yen from the state-run Development Bank of Japan Inc. The company also received 100 billion yen from lenders to help pay for restructuring.

“It’s unacceptable” if the allegation is true, Trade Minister Yukio Edano said in a separate statement. He told ministry employees to refrain from trading securities “for a while.”

The ministry also will ask employees to register brokerage accounts used by them or their spouses with the ministry, according to the statement.
Elpida and Renesas (6723) declined to comment.

Elpida shares declined 1.6 percent to 308 yen in Tokyo trading, and Elpida fell 0.7 percent to 445 yen. The benchmark Nikkei 225 Stock Average dropped 0.7 percent.

Elpida Memory Inc., the world's third-largest manufacturer of dynamic random access memory (DRAM) chips, is seeking a total of 500 million dollars (40 billion yen) in financial assistance from about 10 of its business partners, according to sources.

The companies include U.S., Taiwan and Chinese makers of information technology devices and semiconductors. Elpida also may ask Toshiba Corp. for financial help, the sources said Wednesday.

Elpida's business performance has been deteriorating because of the strong yen and falling prices of their products. The company hopes to make it through the bad times by obtaining funds from the other companies.

Elpida will have to redeem 45 billion yen worth of corporate bonds and repay about 77 billion yen of a total of 110 billion yen in loans from financial institutions in early April.

The company plans to decide on details of the aid through negotiations with the other companies by the end of this month.

Elpida is considering various options, such as receiving advance payments by signing contracts to supply DRAM chips over the long term, and asking for capital contributions to Elpida's subsidiaries.

Samsung Electronics Co. of South Korea holds the lion's share of the world's DRAM market at 45 percent. Elpida says if it hopes to compete it must improve its business situation.

Some government and financial institutions are trying to strengthen the relationship between Elpida and Toshiba, as they could complement each other since Toshiba manufactures different products from Elpida.

Elpida is Japan's only DRAM maker. Its earnings started to deteriorate after the collapse of Lehman Brothers Holdings Inc. in 2008.

In June 2009, Elpida received 30 billion yen of public loans via the Development Bank of Japan under the Law on Special Measures for Industrial Revitalization.

Elpida later received another 10 billion yen from the DBJ and 100 billion yen from 14 private banks, including three megabanks, as syndicated loans.

(Jan. 6, 2012)

Ten times faster? Are you excited about USB 3.0?
Surely launching Windows 8 is an inspiring news already. Moreover, USB 3.0 will truly bring our lives more convenience.

Quote "Microsoft has revealed that Windows 8 will boast “robust” support for USB 3.0 devices, though it will continue to support old USB specifications.

Microsoft’s Dennis Flanagan, the director of program management for its Devices and Networking group, explained the engineering work Microsoft is undertaking to support USB 3.0 on the company’s blog. The USB standard is more than 10 times as fast as its predecessor, USB 2.0. Its competitor, Apple, has opted for the faster Thunderbolt standard.

“The decision to invest in USB 3.0 was an easy one to make, but doing so without compromising the existing USB ecosystem was a big challenge to overcome,” Flanagan said in a blog post. “Our design had to follow the revised 3.0 specification precisely in order to enable emerging USB 3.0 hardware. There are also billions of older USB devices that Windows must remain compatible with.”

To make USB 3.0 work with the next generation of Windows, Flanagan says that Microsoft started working with hardware manufacturers early to “meticulously design a new USB software stack for the new controller while maintaining existing interfaces and behaviors, ensuring every device and driver will work.” To do this, they refined a software model checking tool called Zing to test every aspect of its software model.

Other work done to prepare for USB 3.0 included extensive hardware testing and creating a custom tool called MUTT (USB Test Tool) “to simulate a full range of device behaviors that we’d observed over the years.” Essentially, it allowed Microsoft to test 1,000 different USB devices with a single USB thumb drive."

[list=]MFG Qty Best price
M379B5773CH0-CH900 -SAMSUNG RETAIL 500 14
M379B5273CH0-CH9 -SAMSUNG RETAIL 100 27
M473B5773CH0-CH9 -SAMSUNG RETAIL 500 14
M473B5273CH0-CH9 -SAMSUNG RETAIL 50 27
MV-2V1G4 D2-1G-800 VLP SAMSUNG RETAIL 500 14
MV-2V2G4 D2-2G-800 VLP SAMSUNG RETAIL 200 25
M470T2863FBC-CF7 -SAMSUNG RETAIL 200 14
MV-2S2G4 D2-2G800 SODIM VLP SAMSUNG RETAIL 1 25
HYMP125U64CP8-S6;800 2G HY/O 1 22
HYMP112U64CP8-S6-C ;1G800 HY/ 1 13
HYMP125S64CP8-S6;800 2G SODIM 1 21.5
MFG-PART#: HMP31GP7AFR4C-Y5 1 242
MFG-PART#: HYMP151P72CP4-Y5-C 400 92
HYMP125P72CP8-Y5 2G/E/R*8 HY/ 100 40
HMT42GR7BMR4C-H9D7 16G HY/O 500 185
HMT31GR7BFR4C-PBD3 1600/8G/E/R 1 105
HMT31GR7BFR4A-H9 8G 1.35V HY/O 500 75
MFG-PART#: HMT31GR7BFR4C-H9D7 50 76
HMT31GR7BFR4C-H9 8G/E/R*4 HY/O 1 78
MFG-PART#: HMT351R7BFR8C-H9 50 46
DDR3 1333 4G/ECC/REG*4 HYNIX/O 1 48
MFG-PART#: HMT151R7TFR4C-H9D7 50 49
HMT151R7TFR4C-H9T7 4G/E/R HY/O 1 50
HMT125R7TFR8C-H9T7 D3 2G/E/R*8 1 35
HMT42GR7BMR4C-G7;16G/E/R HY/O 250 180
HMT351S6BFR8C-H9;1333 4G HY/O 1 23
HMT351S6CFR8C-H9;1333 4G HY/O 1 23
HMT351U6CFR8C-H9N0 D3-4G HY/O 500 22
HYMP151F72CP4D3-S5 800 4G HY/O 1 94
MFG-PART#: HMP31GF7AFR4C-Y5D5 300 235
MFG-PART#: HYMP151F72CP4D3-Y5 1 93
HYMP151F72CP8D5-Y5 667/4G HY/O 200 93
M392B1K70CM0-CH9 8G VLP 1.5V 500 102
M392B1K70CM0-CH9 8G VLP 1.5V 200 98
D3-1333 8G/E/R SA/O 512*4 1.35 10 88
MFG-PART#: M393B1K70CH0-CH904 50 74
MFG-PART#: M393B1K70CH0-CH905 1 78
MFG-PART#: M393B5170FHO-YH904 200 41
MFG-PART#: M393B5170FHO-CH905 1 43
M393B5170FHO-CH904 4G/E/R SAM 1000 42
M393B5273CH0-CH9 4G 256X8 SA/O 200 41
M393B5270CH0-CH9;4G/E/R SAM 50 37
M393B5673FH0-CH901 2G*8 SAM/O 1500 26
M393B2K70CM0-CF8 16G/E/R SAM/O 500 180
M391B1G73BH0-CH9;8G/ECC SAM/O 20 245
M391B5273CH0-CH9 4G/ECC SAM/O 200 36
MFG-PART#: M378B5273DH0-CH9 2000 21
M378B5773DH0-CH9;2G/8C SAM/O 1500 12
MFG-PART#: M471B5273DH0-CH9 1200 21
M471B5773DH0-CH9 2G SA/O 256X8 2000 12
MFG-PART#: M378T5663FB3-CF7 500 25
MFG-PART#: M470T2864FB3-CF7 500 14
M395T5160FB4-CE68 4G 667 SAM/O 300 92
M395T5750EZ4-CE66 2G FB SAM/O 50 37[/list]
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we are looking for the supplier of Hynix...
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Is there any idea about price of 4G bits DDR3 chip?
I only can find the price of 2Gb chip at DRAMeXchange.

Thank you.

EEMS ASIA Co. Ltd, 100% controlled by EEMS ITALIA, is the parent Company of EEMS CHINA Co. Ltd.

EEMS back-end activities, located in Asia (China), cover all manufacturing steps starting from silicon wafers of our IDM customers, throughout the component assembly and test, and from there extending into the complete subsystems testing, packing and shipping to customers' warehouse or directly dropping to their OEM destinations.
Along with Production, a variety of Technology Development and Engineering Services are available to complete the offering and provide a one-stop-shop solution to customers.

With the objective to serve the growing needs for outsourcing in the Semiconductor Industry, EEMS distinguishes for the unique blend between long dated expertise in Semiconductors/Memory and the fully integrated business model.
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Our customers are always in control of their production status which enables them to plan faster and better.

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EEMS China

EEMS CHINA Pte. Ltd. is the parent Company of EEMS Suzhou Co. Ltd. and EEMS Tech Co. Ltd., the two operating companies of EEMS ASIA

Since February 2007, EEMS China received the ISO 14001 Certification. Below, the Company's Green House Report, in compliance with the above mentioned certification.

Download Green House Gases Report

EEMS Suzhou and EEMS Tech are the first independent A/T Service provider in China to offer state-of-the-art 300mm assembly line packaging with a wide array of packages in single and stacked die configuration. Assembly services offered :

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EEMS strong engineering team offer value added services in addition to production engineering capabilities:

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