DRAMeXchange - Price, Transactions, and research inside DRAM/Flash industry

Dear all,

I have 200 qty brand new with Date Code 11+, pls contact me if interested.

tks

kam.tsang@malabs.com

Have the following stocks in original and factory sealed pack with warrantee and CoC.
HY5PS1G1631CFP-S6-C HYNIX 40,000pcs D/c:2011 DDR-II 1GB(64Mx16) FBGA-84

Note: Picture on demand available. Next day shipping

Have Inventory all In factory sealed pack new and original same day shipping.
MICRON P/N: NAND04GW3B2DN6F 3Kpcs D/c:2010 T/R-1500pcs
SAMSUNG P/N: K4S561632N-LC75000 500Kpcs D/c:2011 TRAY-960
SAMSUNG P/N: K4S561632N-LC75T00 450Kpcs D/c:2011 T/R-2K
SAMSUNG P/N: K4T51163QI-HCE6T00 42,000
SAMSUNG P/N: K4T51163QI-HCE6000 6,400
SAMSUNG P/N: K4T51163QI-HCE7000 2,492

Note: PICTURES available on demand

We have access to the following INVENTORY of a Distributor. All are new and original certified stocks. Date Codes could be earlier than 2010. Do let’s know your buying price if interested in any.
Part Num Make Qty Description SPQ
MT48LC16M16A2P-7E:D TR MICRON 368 SDRAM 256Mb 16Mx16 133MHz TSOP RoHSconf 1
MT48LC64M8A2P-75:C MICRON 664 SDRAM 512Mb 64Mx8 7,5 NS 133MHz RoHSconf 1
TS32MLQ64V6M TRANSCEND 302 DIMM DDR2 256MB 32Mx64 PC2-5300 RoHSconf 1
M368L3223 ETM-CCC SAMSUNG 154 DIMM DDR 256MB 32x64 PC3200 _NO ROHS 1
HYS64T64020HDL-3S-B QIMONDA 93 SO-DIMM DDR2 512MB PC667 RoHSconf 1
MT48LC16M16A2P-75 IT:D MICRON 65 SDRAM 256Mb 16Mx16 7.5NS 133MH RoHSconf 1
KVR400X64SC3A/512 KINGSTON 19 SO-DIMM DDR 512MB 64Mx64 PC3200 RoHSconf 1
MT46V16M16P-6T:K MICRON 172 DDR-SDRAM 256Mb 16Mx16 166MHz RoHSconf 108
MT46V16M16P-6T IT:K MICRON 4,006 DDR-SDRAM 256Mb 16Mx16 166MHz RoHSconf 108
MT46H16M16LFBF-6 IT:H MICRON 430 DDR-SDRAM 256Mb 16Mx16 166MHz RoHSconf 190
MT48LC4M16A2P-6 IT:G MICRON 84 SDRAM 64Mb 4Mx16 6NS 166MHz RoHSconf 108
MT48LC4M16A2P-7E IT:G MICRON 1,752 SDRAM 64Mb 4Mx16 7,5NS 133MHz RoHSconf 108
MT48LC4M32B2P-6 AT:G TR MICRON 2,000 SDRAM 128Mb 4Mx32 166MHz RoHSconf 1000
MT47H64M16HR-25:H MICRON 1,290 DDR2 1Gb 64Mx16 400MHz BGA RoHSconf 104
MT47H64M16HR-3:H MICRON 7,477 DDR2 1Gb 64Mx16 333MHz BGA RoHSconf 104
MT48LC4M32B2P-7 IT:G MICRON 4,181 SDRAM 128Mb 4Mx32 7NS 143MHz RoHSconf 108
MT48H8M32LFB5-75:H MICRON 360 SDRAM 256Mb 8Mx32 133MHz RoHSconf 108
MT41J128M16HA-15E:D MICRON 122 DDR3 2Gb 128Mx16 1333MT/s BGA RoHSconf 104
MT48LC16M16A2BG-75 IT:D TR# MICRON 3,000 SDRAM 256Mb 16Mx16 133MHz BGA RoHSconf 1000
MT47H128M16RT-25E AIT:C MICRON 200 DDR2 2Gb 128Mx16 400MHz BGA RoHSconf 200
MT47H32M16HR-25E AIT:G TR MICRON 1,000 DDR2 512Mb 32Mx16 400MHz BGA RoHSconf 1000
MT46V32M16P-6T IT:F MICRON 176 DDR-SDRAM 512Mb 32Mx16 166MHz RoHSconf 108
MT48LC4M32B2B5-7:G# MICRON 270 SDRAM 128Mb 4Mx32 143MHz BGA RoHSconf 240
MT46H64M32LFMA-6 IT:A MICRON 1,750 DDR-SDRAM 2Gb 64Mx32 166MHz RoHSconf 210
MT46H128M16LFCK-5 IT:A MICRON 4 DDR-SDRAM 2Gb 128Mx16 200MHz RoHSconf 190
MT48LC64M8A2P-75 IT:C MICRON 870 SDRAM 512Mb 64Mx8 7,5 NS 133MHz RoHSconf 108
MT46V32M16BN-6 IT:F TR MICRON 2,000 DDR-SDRAM 512Mb 32Mx16 166MHz RoHSconf 1000
MT48LC4M16A2P-75 IT:G TR MICRON 28,000 SDRAM 64Mb 4Mx16 7,5NS 133MHz RoHSconf 1000
MT48LC4M16A2P-75 IT:G TR MICRON 14,000 SDRAM 64Mb 4Mx16 7,5NS 133MHz RoHSconf 1000
MT48LC2M32B2P-7 IT:G TR MICRON 21,000 SDRAM 64Mb 2Mx32 7NS 143MHz RoHSconf 1000
MT46V32M16BN-6 IT:F TR MICRON 9,000 DDR-SDRAM 512Mb 32Mx16 166MHz RoHSconf 1000
MT47H64M16HR-3 AIT:H TR MICRON 78,000 DDR2 1Gb 64Mx16 333MHz BGA RoHSconf 1000
MT47H32M16HR-25E AIT:G TR MICRON 5,000 DDR2 512Mb 32Mx16 400MHz BGA RoHSconf 1000
MT46H64M16LFBF-5 IT:B TR MICRON 58,000 DDR-SDRAM 1Gb 64Mx16 200MHz RoHSconf 1000
MT46H128M16LFCK-5 IT:A TR MICRON 13,000 DDR-SDRAM 2Gb 128Mx16 200MHz RoHSconf 1000
MT48LC16M16A2P-75 IT:D TR MICRON 2,315 SDRAM 256Mb 16Mx16 7.5NS 133MH RoHSconf 1000
MT48LC16M16A2BG-75 IT:D TR MICRON 9,000 SDRAM 256Mb 16Mx16 133MHz BGA RoHSconf 1000
MT46V16M16CY-5B IT:K TR MICRON 104,000 DDR-SDRAM 256Mb 16Mx16 200MHz RoHSconf 1000
MT48H32M16LFBF-75 IT:B TR MICRON 81,000 SDRAM 512Mb 32Mx16 133MHz 1,8V RoHSconf 1000
MT47H32M16HR-25E AIT:G TR MICRON 5,000 DDR2 512Mb 32Mx16 400MHz BGA RoHSconf 1000
MT46V16M16CY-5B AIT:M MICRON 1,140 DDR-SDRAM 256Mb 16Mx16 200MHz RoHSconf 228
MT46H32M16LFBF-6 IT:B MICRON 5,000 DDR-SDRAM 512Mb 32Mx16 166MHz RoHSconf 297
MT48H16M32LFCM-75 IT:B MICRON 15,668 SDRAM 512Mb 16Mx32 7.5NS 133MHz RoHSconf 108
MT48LC16M16A2P-75 IT:D MICRON 65 SDRAM 256Mb 16Mx16 7.5NS 133MH RoHSconf 108
MT48LC16M16A2P-75:D MICRON 145 SDRAM 256Mb 16Mx16 7.5NS 133MH RoHSconf 108
MT48LC4M16A2P-75:G TR MICRON 17,000 1DRAM 64Mb 4Mx16 133MHz TSOP RoHSconf 1000
MT48LC8M16A2P-75:G MICRON 364 SDRAM 128Mb 8Mx16 133MHz TSOP RoHSconf 108
MT48LC8M16A2P-7E IT:G MICRON 6 SDRAM 128Mb 8Mx16 7,5NS 133MHz RoHSconf 108
MT48LC16M16A2P-7E:D TR MICRON 368 SDRAM 256Mb 16Mx16 133MHz TSOP RoHSconf 1000
MT48LC2M32B2P-6:G MICRON 1,454 SDRAM 64Mb 2Mx32 166MHz TSOP RoHSconf 108
MT48LC16M16A2BG-75:D MICRON 13,000 SDRAM 256Mb 16Mx16 133MHz BGA RoHSconf 108
MT48LC4M32B2B5-7:G MICRON 6,059 SDRAM 128Mb 4Mx32 143MHz BGA RoHSconf 240
MT48LC64M8A2P-75:C MICRON 664 SDRAM 512Mb 64Mx8 7,5 NS 133MHz RoHSconf 108
MT46V32M16P-6T:F MICRON 558 DDR-SDRAM 512Mb 32Mx16 166MHz RoHSconf 108
MT48LC32M8A2P-75:D MICRON 1,406 SDRAM 256Mb 32Mx8 7.5NS 133MHz RoHSconf 108
MT46V32M16P-6T:F TR MICRON 15,000 DDR-SDRAM 512Mb 32Mx16 166MHz RoHSconf 1000
MT46V32M16FN-6:F MICRON 384 DDR-SDRAM 512Mb 32Mx16 166MHz _NO ROHS 108
MT29F4G16ABBDAH4-IT:D MICRON 1,925 NAND-Flash 256Mx16 VFBGA 1,8V RoHSconf 1000
MT29F2G16ABBEAHC-IT:E TR MICRON 14,000 NAND-Flash 128Mx16 VFGBA63 1,8V RoHSconf 1000
MT29F4G08ABBDAH4-IT:D TR MICRON 25 NAND-Flash 512Mx8 VFBGA63 3,3V RoHSconf 1000
R1LV1616HSA-4SI#B0 RENESAS 1,036 SRAM 1Mx16 45ns TSOP48 RoHSconf 96
HM28100TTI5SE RENESAS 1,430 SRAM 1Mx8 55ns TSOP44 RoHSconf 96

Thanks with Best Regards
SATI DASS
[b]INNOVISION COMPONENTS LTD[/b]
(Co. Reg. No: 05356164 (England and Wales) VAT No: 927489476 D&B No: 345461425)
Offices & Ware houses : USA/LONDON /SINGAPORE /Hong Kong /INDIA
Phone : +44-20-8900.5225 / 8900.5200
Fax : +44-20-8903.3468
satid@innovision-group.net

EEMS ASIA Co. Ltd, 100% controlled by EEMS ITALIA, is the parent Company of EEMS CHINA Co. Ltd.

EEMS back-end activities, located in Asia (China), cover all manufacturing steps starting from silicon wafers of our IDM customers, throughout the component assembly and test, and from there extending into the complete subsystems testing, packing and shipping to customers' warehouse or directly dropping to their OEM destinations.
Along with Production, a variety of Technology Development and Engineering Services are available to complete the offering and provide a one-stop-shop solution to customers.

With the objective to serve the growing needs for outsourcing in the Semiconductor Industry, EEMS distinguishes for the unique blend between long dated expertise in Semiconductors/Memory and the fully integrated business model.
The memory packaging specialist
EEMS geographic deployment is able to exploit links with a powerful supply chain in Asia.
The outcome is an extraordinarily experienced team, capable to offer a wide breadth of solutions and values to selected customers willing to invest into long term strategic relationships.

Our Asia business operations is managed by a team with a significant experience that ensures world class customer service standards.
Our factories and processes are planned to integrate customer’s production requirements, thus becoming Customers Virtual Factories.
Our customers are always in control of their production status which enables them to plan faster and better.

http://www.eems.com/en.php?pid=141&page=EEMS%20Asia

EEMS China

EEMS CHINA Pte. Ltd. is the parent Company of EEMS Suzhou Co. Ltd. and EEMS Tech Co. Ltd., the two operating companies of EEMS ASIA

Since February 2007, EEMS China received the ISO 14001 Certification. Below, the Company's Green House Report, in compliance with the above mentioned certification.

Download Green House Gases Report

EEMS Suzhou and EEMS Tech are the first independent A/T Service provider in China to offer state-of-the-art 300mm assembly line packaging with a wide array of packages in single and stacked die configuration. Assembly services offered :

IC Packaging - FdBGA, FBGA, TSOP I, TSOP II, HQFP, e-LQFP, LQFP
Module Assembly - UDIMM, SODIMM


EEMS high value test assets deliver high end and competitive test solutions:

Advanced Memory Test on Advantest T5503, Verigy V93k, Unitest Uni930 and JEC TDBI systems
System applications test for memory modules and customized end applications


EEMS strong engineering team offer value added services in addition to production engineering capabilities:

IC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure AnalysisIC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure AnalysisIC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure Analysis


http://www.eems.com/en.php?pid=162&page=Services

http://www.eems.com/en.php?pid=153&page ... evelopment

http://www.eems.com/en.php?pid=154&page ... 0Portfolio

PRESS ROOM
http://www.eems.com/en.php?pid=156&page ... 0sensitive

http://www.eems.com/en.php?pid=201&page ... %20Release

According to me is a big occasion, in anticipation of an economic recovery.

Semiconductors and photovoltaics are 2 areas that fly with economic development.

Quoted in Italy

Which brand, is it packed or loose.

I am of those who expect the USB 3.0 will be the best to use it, I hope to be placed on the market quickly

You see that DRAM prices are going up nicely right now, after plunging during 2011. It might thus make sense to pay some attention to the quoted suppliers, of which Micron (MU) is the most obvious one.

A brief look into Micron

Micron Technology Inc. has a market capitalization of $6.9 billion, and is trading at a forward P/E of 18.89 next year. MU has a low Price/Book of 0.83. There are studies that indicate that low Price/Book stocks outperform over time, although some times the low Price/Book is also an indication of risk or permanently bad profitability.

The stock has been having a strong performance lately, being up 11.84% in just the last week and also up 11.13% year-to-date. Micron is clearly outperforming the market in these last few days, and it is probably no coincidence, so the DRAM price climb is not going unnoticed. The stock is also not incredibly cheap, still cyclical stocks hardly ever seem cheap when the cycle is bottoming out.

DRAM is probably the most cyclical of the semiconductor end markets, and semi stocks in general are very cheap. Beyond thinking of taking positions in Micron due to the DRAM price climb, one might also need to be aware that other semiconductor segments might also find their bottoms around here.

Among the many semiconductor and semiconductor equipment stocks that seem cheap, a large capitalization stands out, Intel (INTC):

Intel Corporation (INTC)

Intel Corporation has a market capitalization of $127.9 billion, and is trading at a TTM P/E of 10.87 with expected earnings growth of 0.42% taking it to a forward P/E of 10.59 next year. The TTM P/E means INTC trades at a discount to the S&P500 TTM P/E of 13.0. The PEG (Price/Earnings Growth) stands at 1.02. The Price/Book is 2.79.

INTC's dividend yield is generous at 3.35%, this equates to a dividend payout of 30.30%. The dividend exceeds the S&P500 dividend yield, presently at 2.1%. The dividend is higher than the yield on the 10 year bond, presently at 1.99%.

The ROE is quite high at 27.21%, which is usually a sign of a good business (though sometimes cyclicality can be the reason).

INTC is up by 3.55% year-to-date.

Intel does seem like a long-term investment opportunity, even though it suffered a few downward revisions to estimates due to the Thailand floods.

Conclusion

The DRAM market is showing an upwards price swing, which might be an indication of a favorable turn in its cycle. More generally, this might also be a positive indication for semiconductors and semiconductor equipment in general. Given the number of stocks trading at very attractive valuations in these sectors, it might pay to be aware of it and study it further. I expect some near term weakness in the market in the context of a medium term uptrend. If this weakness comes to pass, it might be a good time to buy into these sectors.

Shares of Micron Technology Inc jumped as much as 11 percent on a report that one its biggest competitors, Elpida Memory, may merge with Toshiba Corp, in a sign of consolidation in an industry hurt by cut-throat competition.

On Tuesday, DigiTimes reported that the Japanese government was brokering talks between the troubled DRAM (dynamic random access memory chips) maker and Toshiba to merge operations.

"The Elpida news is a definite sign of consolidation which could lead to significantly better pricing in the industry," Nomura analyst Sidney Ho told Reuters.

Micron -- the only U.S. maker of DRAMs in a market flooded by Asian rivals -- has seen margins deteriorate over the last couple of quarters as oversupply hurt margins.

According to DRAMeXchange, an industry tracker, DRAM contract prices fell 58 percent last year, while spot price decreased 70 percent.

Elpida -- the number three maker of DRAMs -- has been struggling to pay back debt and was reported to have been in talks recently with Taiwan-based Nanya Technology to raise funds.

"We do expect a further consolidation in commodity DRAMs which eventually will lead to a price stabilization, starting in the second quarter," Robert Baird analyst Tristan Gerra said.

The DigiTimes report cited unnamed sources to say Toshiba may not attempt to return to the DRAM market if it integrates with Elpida.

"From a memory consolidation perspective it's a positive for the industry, that's what the market is looking at," Raymond James analyst Hans Mosesmann said about the report.

Shares of Micron, which is valued at $6.2 billion, were trading up 6 percent at $6.68 around midday on Nasdaq after touching a high of $6.96 in morning trade.

Separately, Barclays Capital raised the DRAM memory maker's stock to "overweight," citing better pricing in 2012, even as the brokerage downgraded five other technology stocks, including Intel Corp.

It expects Micron to benefit from higher pricing and stronger PC sales, likely from the second half of the year, the brokerage wrote in a note.

Market now has the rumor about the memory chipmaker, Elpida, has been suffering its own financial crisis. This shortage of money and investment and debt to Japan government makes Elpida likely be integrated by another Japanese chipmaker, Toshiba.

Without doubt, the high-level executives of both Elpida and Toshiba have both denied to comment on this rumor. However it is said that the Japan government is pressing for this major negotiation.

If Elpida, a main supplier of flash memory chips is really to be integrated by Toshiba, the sole DRAM maker in Japan, as the rumor said, this would coordinate both sides’ DRAM and flash, and keep Japan from being marginalized. Especially nowadays Korea has expended its global professional presence in semiconductor industry.

Obviously, this integration could leverage Elpida’s mobile RAM to optimize the development of its flash memory relevant products. But on the other hand, source did say that Toshiba won’t go back to the DRAM market even with the synergy this integration can bring.

Hello Dear All,


We are always looking for ink Die on Table, if you can keep long term
to supply us, pls contact with us immediately


QQ:949474291
mail:949474291@qq.com
MSN:HB81213@HOTMAIL.COM

Ten times faster? Are you excited about USB 3.0?
Surely launching Windows 8 is an inspiring news already. Moreover, USB 3.0 will truly bring our lives more convenience.

Quote "Microsoft has revealed that Windows 8 will boast “robust” support for USB 3.0 devices, though it will continue to support old USB specifications.

Microsoft’s Dennis Flanagan, the director of program management for its Devices and Networking group, explained the engineering work Microsoft is undertaking to support USB 3.0 on the company’s blog. The USB standard is more than 10 times as fast as its predecessor, USB 2.0. Its competitor, Apple, has opted for the faster Thunderbolt standard.

“The decision to invest in USB 3.0 was an easy one to make, but doing so without compromising the existing USB ecosystem was a big challenge to overcome,” Flanagan said in a blog post. “Our design had to follow the revised 3.0 specification precisely in order to enable emerging USB 3.0 hardware. There are also billions of older USB devices that Windows must remain compatible with.”

To make USB 3.0 work with the next generation of Windows, Flanagan says that Microsoft started working with hardware manufacturers early to “meticulously design a new USB software stack for the new controller while maintaining existing interfaces and behaviors, ensuring every device and driver will work.” To do this, they refined a software model checking tool called Zing to test every aspect of its software model.

Other work done to prepare for USB 3.0 included extensive hardware testing and creating a custom tool called MUTT (USB Test Tool) “to simulate a full range of device behaviors that we’d observed over the years.” Essentially, it allowed Microsoft to test 1,000 different USB devices with a single USB thumb drive."

Although business headlines still tout earnings numbers, many investors have moved past net earnings as a measure of a company's economic output. That's because earnings are very often less trustworthy than cash flow, since earnings are more open to manipulation based on dubious judgment calls.
Earnings' unreliability is one of the reasons Foolish investors often flip straight past the income statement to check the cash flow statement. In general, by taking a close look at the cash moving in and out of the business, you can better understand whether the last batch of earnings brought money into the company, or merely disguised a cash gusher with a pretty headline.
Calling all cash flows
When you are trying to buy the market's best stocks, it's worth checking up on your companies' free cash flow once a quarter or so, to see whether it bears any relationship to the net income in the headlines. That's what we do with this series. Today, we're checking in on Micron Technology (NAS: MU) , whose recent revenue and earnings are plotted below.


Over the past 12 months, Micron Technology burned $626.0 million cash while it booked a net loss of $175.0 million. That means it burned through all its revenue and more. That doesn't sound so great. FCF is less than net income. Ideally, we'd like to see the opposite.
All cash is not equal
Unfortunately, the cash flow statement isn't immune from nonsense, either. That's why it pays to take a close look at the components of cash flow from operations, to make sure that the cash flows are of high quality. What does that mean? To me, it means they need to be real and replicable in the upcoming quarters, rather than being offset by continual cash outflows that don't appear on the income statement (such as major capital expenditures).
For instance, cash flow based on cash net income and adjustments for non-cash income-statement expenses (like depreciation) is generally favorable. An increase in cash flow based on stiffing your suppliers (by increasing accounts payable for the short term) or shortchanging Uncle Sam on taxes will come back to bite investors later. The same goes for decreasing accounts receivable; this is good to see, but it's ordinary in recessionary times, and you can only increase collections so much. Finally, adding stock-based compensation expense back to cash flows is questionable when a company hands out a lot of equity to employees and uses cash in later periods to buy back those shares.
So how does the cash flow at Micron Technology look? Take a peek at the chart below, which flags questionable cash flow sources with a red bar.


When I say "questionable cash flow sources," I mean items such as changes in taxes payable, tax benefits from stock options, and asset sales, among others. That's not to say that companies booking these as sources of cash flow are weak, or are engaging in any sort of wrongdoing, or that everything that comes up questionable in my graph is automatically bad news. But whenever a company is getting more than, say, 10% of its cash from operations from these dubious sources, investors ought to make sure to refer to the filings and dig in.
With questionable cash flows amounting to only 9.9% of operating cash flow, Micron Technology's cash flows look clean. Within the questionable cash flow figure plotted in the TTM period above, stock-based compensation and related tax benefits provided the biggest boost, at 3.6% of cash flow from operations. Overall, the biggest drag on FCF came from capital expenditures.
A Foolish final thought
Most investors don't keep tabs on their companies' cash flow. I think that's a mistake. If you take the time to read past the headlines and crack a filing now and then, you're in a much better position to spot potential trouble early. Better yet, you'll improve your odds of finding the underappreciated home-run stocks that provide the market's best returns.

Prices of dynamic random access memory chips paused their falling trend in December on the back of seasonal demand, snapping a long losing streak, industry data showed Wednesday.

According to DRAMeXchange Technology Inc., the average price of the benchmark DDR3 2 gigabit, 256Mx8 1333 megahertz device was set at US$0.88 in the second half of last month, unchanged from two weeks ago.

The Taiwan-based company, Asia‘s largest operator of a semiconductor spot market, compiles chip prices twice a month.

The price of the key chips, which are used in personal computers, had suffered from sustained falls since September 2010 when the price peaked at $4.34 on weak demand for PCs. Floods in Thailand last year also undercut demand for DRAM chips.

Market watchers said a letup in falls of DRAM prices resulted from year-end demand for PCs and cautiously predicted DRAM prices may gain some ground in the first quarter.

Prices of other DRAM devices remained flat in the first half of last month, compared with two weeks earlier, data from DRAMeXchange showed.

South Korea’s total overseas shipments hit a record high of $557.8 billion last year, but suffered from slumping exports of semiconductors due to a fall in key chip prices. The country‘s exports of semiconductors declined 1.1 percent on-year to $50.1 billion in 2011.

Hello Dear All,


We are always looking for ink Die on Table, if you can keep long term
to supply us, pls contact with us immediately


QQ:949474291
mail:949474291@qq.com
MSN:HB81213@HOTMAIL.COM

Ten times faster? Are you excited about USB 3.0?
Surely launching Windows 8 is an inspiring news already. Moreover, USB 3.0 will truly bring our lives more convenience.

Quote "Microsoft has revealed that Windows 8 will boast “robust” support for USB 3.0 devices, though it will continue to support old USB specifications.

Microsoft’s Dennis Flanagan, the director of program management for its Devices and Networking group, explained the engineering work Microsoft is undertaking to support USB 3.0 on the company’s blog. The USB standard is more than 10 times as fast as its predecessor, USB 2.0. Its competitor, Apple, has opted for the faster Thunderbolt standard.

“The decision to invest in USB 3.0 was an easy one to make, but doing so without compromising the existing USB ecosystem was a big challenge to overcome,” Flanagan said in a blog post. “Our design had to follow the revised 3.0 specification precisely in order to enable emerging USB 3.0 hardware. There are also billions of older USB devices that Windows must remain compatible with.”

To make USB 3.0 work with the next generation of Windows, Flanagan says that Microsoft started working with hardware manufacturers early to “meticulously design a new USB software stack for the new controller while maintaining existing interfaces and behaviors, ensuring every device and driver will work.” To do this, they refined a software model checking tool called Zing to test every aspect of its software model.

Other work done to prepare for USB 3.0 included extensive hardware testing and creating a custom tool called MUTT (USB Test Tool) “to simulate a full range of device behaviors that we’d observed over the years.” Essentially, it allowed Microsoft to test 1,000 different USB devices with a single USB thumb drive."

Market now has the rumor about the memory chipmaker, Elpida, has been suffering its own financial crisis. This shortage of money and investment and debt to Japan government makes Elpida likely be integrated by another Japanese chipmaker, Toshiba.

Without doubt, the high-level executives of both Elpida and Toshiba have both denied to comment on this rumor. However it is said that the Japan government is pressing for this major negotiation.

If Elpida, a main supplier of flash memory chips is really to be integrated by Toshiba, the sole DRAM maker in Japan, as the rumor said, this would coordinate both sides’ DRAM and flash, and keep Japan from being marginalized. Especially nowadays Korea has expended its global professional presence in semiconductor industry.

Obviously, this integration could leverage Elpida’s mobile RAM to optimize the development of its flash memory relevant products. But on the other hand, source did say that Toshiba won’t go back to the DRAM market even with the synergy this integration can bring.

Elpida Memory Inc., the world's third-largest manufacturer of dynamic random access memory (DRAM) chips, is seeking a total of 500 million dollars (40 billion yen) in financial assistance from about 10 of its business partners, according to sources.

The companies include U.S., Taiwan and Chinese makers of information technology devices and semiconductors. Elpida also may ask Toshiba Corp. for financial help, the sources said Wednesday.

Elpida's business performance has been deteriorating because of the strong yen and falling prices of their products. The company hopes to make it through the bad times by obtaining funds from the other companies.

Elpida will have to redeem 45 billion yen worth of corporate bonds and repay about 77 billion yen of a total of 110 billion yen in loans from financial institutions in early April.

The company plans to decide on details of the aid through negotiations with the other companies by the end of this month.

Elpida is considering various options, such as receiving advance payments by signing contracts to supply DRAM chips over the long term, and asking for capital contributions to Elpida's subsidiaries.

Samsung Electronics Co. of South Korea holds the lion's share of the world's DRAM market at 45 percent. Elpida says if it hopes to compete it must improve its business situation.

Some government and financial institutions are trying to strengthen the relationship between Elpida and Toshiba, as they could complement each other since Toshiba manufactures different products from Elpida.

Elpida is Japan's only DRAM maker. Its earnings started to deteriorate after the collapse of Lehman Brothers Holdings Inc. in 2008.

In June 2009, Elpida received 30 billion yen of public loans via the Development Bank of Japan under the Law on Special Measures for Industrial Revitalization.

Elpida later received another 10 billion yen from the DBJ and 100 billion yen from 14 private banks, including three megabanks, as syndicated loans.

(Jan. 6, 2012)

EEMS ASIA Co. Ltd, 100% controlled by EEMS ITALIA, is the parent Company of EEMS CHINA Co. Ltd.

EEMS back-end activities, located in Asia (China), cover all manufacturing steps starting from silicon wafers of our IDM customers, throughout the component assembly and test, and from there extending into the complete subsystems testing, packing and shipping to customers' warehouse or directly dropping to their OEM destinations.
Along with Production, a variety of Technology Development and Engineering Services are available to complete the offering and provide a one-stop-shop solution to customers.

With the objective to serve the growing needs for outsourcing in the Semiconductor Industry, EEMS distinguishes for the unique blend between long dated expertise in Semiconductors/Memory and the fully integrated business model.
The memory packaging specialist
EEMS geographic deployment is able to exploit links with a powerful supply chain in Asia.
The outcome is an extraordinarily experienced team, capable to offer a wide breadth of solutions and values to selected customers willing to invest into long term strategic relationships.

Our Asia business operations is managed by a team with a significant experience that ensures world class customer service standards.
Our factories and processes are planned to integrate customer’s production requirements, thus becoming Customers Virtual Factories.
Our customers are always in control of their production status which enables them to plan faster and better.

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EEMS China

EEMS CHINA Pte. Ltd. is the parent Company of EEMS Suzhou Co. Ltd. and EEMS Tech Co. Ltd., the two operating companies of EEMS ASIA

Since February 2007, EEMS China received the ISO 14001 Certification. Below, the Company's Green House Report, in compliance with the above mentioned certification.

Download Green House Gases Report

EEMS Suzhou and EEMS Tech are the first independent A/T Service provider in China to offer state-of-the-art 300mm assembly line packaging with a wide array of packages in single and stacked die configuration. Assembly services offered :

IC Packaging - FdBGA, FBGA, TSOP I, TSOP II, HQFP, e-LQFP, LQFP
Module Assembly - UDIMM, SODIMM


EEMS high value test assets deliver high end and competitive test solutions:

Advanced Memory Test on Advantest T5503, Verigy V93k, Unitest Uni930 and JEC TDBI systems
System applications test for memory modules and customized end applications


EEMS strong engineering team offer value added services in addition to production engineering capabilities:

IC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure AnalysisIC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure AnalysisIC Package Design
Test Solutions Development and Yield Optimization
Reliability and Failure Analysis


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